PCB Manufacturing Capabilities
Laritech currently utilizes five production lines for manufacturing PCB's. Each line is specialized for unique customer requirements. In addition to Laritech's Engineering capabilities, Laritech has grown organically to support our customer's production requirements. From PCBA to complete Box Builds whether you need a single prototype or low to high volume assembly, our state of the art equipment and seasoned staff are available to assist you.
Don't miss our printed circuit board solutions in Case Studies, offering a diversity of Laritech PCB's, programming and integration.
High Volume PCB Assembly (Line 1)
Features:
100,000 placements per hour
Component size from 0201- 3 1/2" BGA’s or 5" X 1/2" connectors
Line One PCB assembly equipment includes:
EKRA X4 Base Screen Printer
Koh Young 3D Paste Inspection
Siemens SiPlace HS-60 Very High Speed SMD Placement
Siemens SiPlace 80S20 High Speed SMD Placement
Siemens SiPlace HF-3 Hi Flex SMD Placement
Heller 1707 MKIII Reflow Oven
Koh Young 3D Automated Optical Inspection
High Volume PCB Assembly (Line 2)
Features:
49,000 placements per hour
Component Size range from 0201 to 2" BGA's
Line Two PCB assembly equipment includes:
MPM Ultraprint 2000
Koh Young 3D Paste Inspection
Siemens SiPlace HS-60 Very High Speed SMD Placement
Siemens SiPlace 80S20 High Speed SMD Placement
Siemens SiPlace CF High Speed SMD Placement
Heller 1707 MKIII Reflow Oven
Yestech FX Series Automated Optical Inspection
Quick Turn PCB Assembly (Line 3)
Features:
30,000 placements per hour
Component size range from 0402- 2" BGA's
Line 3 PCB Assembly equipment includes:
MPM Speedline Screen Printer
Siemens SiPlace 80S20 High Speed SMD Placement
Siemens SiPlace 4F High Speed SMD Placement
Heller 1707 MKIII Reflow Oven
Mirtec Automated Optical Inspection
Quick Turn PCB Assembly (Line 4)
Features:
4500 placements per hour
Component size range from 0402-2" BGA's
Line Four PCB assembly equipment includes:
Manncorp 4500 Screen Printer
Juki Placemat 570
Heller 1707 MKIII Reflow Oven
Thru-hole PCB Assembly (Line 5)
Line Five PCB assembly equipment includes:
Vitronics-Soltec Midi-Wave
Hakko 485 Mini Wave Leaded
Hakko 485 Mini Wave Lead-free
SeHo Selective Solder Machine
Various cutting and component prep machines
Other PCB Assembly Equipment includes:
BP Micro Universal Programmer
Creative Electron High Definition X-Ray
AQUA KLEAN T-12 Typhoon in-line Aqueous Cleaner
BGA Rework
Airvac Onyx 29 BGA Rework Machine
Various BGA inspection and reballing equipment
Laritech's new BGA advanced SMT production rework and assembly machine provides an unparalleled level of automation and process control for SMT rework and assembly.
Applications
Lead-Free, 0201, Flip Chip, Micro BGA/CSP, MEMS, Optoelectronics, Microwave, MLF's and other devices. Existing technology including BGA, CSP, Leaded Devices and Surface Mount Connectors can also be easily accommodated.
Benefits:
9 micron placement accuracy (0.0003") @ 3 Sigma
High volume rework
Ultra-fast heat up for Lead-Free Rework
Fast, controlled board cool down
Process repeatability
Uniform joint temperature
Precision air flow
Simple, fast & easy to use software
Large, clear images for component alignment
Components up to 3.0" (75mm)
Micro site cleaning
Clean and uniform pads for replacement device
Solder dots or lines down to 0.010"
Dispensing of solder paste, epoxy, under fill or flux